Patent · US Active

Variable in-plane signal to ground reference configurations

US11705390B2 · kind B2 · utility

0Cited by

4References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Andrew Collins · Chandler, US
Arghya Sain · Chandler, US

Key dates

Filing date	Mar 27, 2019
Grant date	Jul 18, 2023
Priority date	—
Expiry date	Oct 23, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments disclosed herein include electronic packages with improved differential signaling architectures. In an embodiment, the electronic package comprises a package substrate, where the package substrate comprises alternating metal layers and dielectric layers. In an embodiment, a first trace is embedded in the package substrate, where the first trace has a first thickness that extends from a first metal layer to a second metal layer. In an embodiment, the electronic package further comprises a first ground plane laterally adjacent to a first side of the first trace, and a second ground plane laterally adjacent to a second side of the first trace.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.