Patent · US Active

Semiconductor process chamber with heat pipe

US11710620B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Kai Wei · Hangzhou City, CN
Che-Fu Chen · Hsinchu, TW

Key dates

Filing date	Oct 27, 2020
Grant date	Jul 25, 2023
Priority date	—
Expiry date	Jan 5, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/3321
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor processing system processes semiconductor wafers in a process chamber. The process chamber includes semiconductor process equipment for performing semiconductor processes within the chamber. The process chamber includes a heat pipe integrated with one or more components of the process chamber. The heat pipe effectively transfers heat from within the chamber to an exterior of the chamber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.