Fan-out packaging method and fan-out packaging plate

US11710646B2 · kind B2 · utility

Assignee

• SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP (LIMITED PARTNERSHIP) · CN

Inventors

• Chuan Hu · Chandler, US
• Yingqiang YAN · Longbeilingcun, CN
• Yuejin Guo · Phoenix, US
• Yingjun Pi · Lo Wu, CN
• Junjun Liu · Suzhou, CN
• Edward R. Prack · Phoenix, US

Key dates

• Filing date: Oct 11, 2018
• Grant date: Jul 25, 2023
• Expiry date: Jan 24, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A fan-out packaging method includes: prepare circuit patterns on one side or both sides of a substrate; install electronic parts on one side or both sides of the substrate; prepare packaging layers on both sides of the substrate; the packaging layers on both sides of the substrate package the substrate, the circuit patterns, and the electronic parts, the packaging layers being made of a thermal-plastic material; wherein the substrate is provided with a via hole; both sides of the substrate are communicated by means of the via hole; a part of the packaging layers penetrate through the via hole when the packaging layers are prepared on both sides of the substrate; and the packaging layers on both sides of the substrate are connected by means of the via hole.