Hyperbaric clean method and apparatus for cleaning semiconductor chamber components

US11710647B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Richard W. Plavidal · Ridgway, US
• Scott Osterman · Whitefish, US
• David W. Groechel · Los Altos Hills, US
• Gang Peng · Beijing, CN
• John Z. Smith · Kalispell, US

Key dates

• Filing date: Jan 28, 2021
• Grant date: Jul 25, 2023
• Expiry date: Jan 28, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67248
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of a methods and cleaning systems for cleaning components for use in substrate processing equipment are provided herein. In some embodiments, a cleaning system includes a boiler having a heater configured to heat a fluid; a clean chamber fluidly coupled to the boiler via at least one of a gas line and a liquid line, wherein the clean chamber includes one or more fixtures in an interior volume therein for holding at least one component to be cleaned, and wherein the clean chamber includes a heater for heating the interior volume; and an expansion chamber fluidly coupled to the clean chamber via a release line for evacuating the clean chamber, wherein the release line includes a release valve to selectively open or close a flow path between the expansion chamber and the clean chamber, and wherein the expansion chamber includes a chiller and a vacuum port.