Microelectronic package with underfilled sealant
US11710672B2 · kind B2 · utility
0Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2019 |
| Grant date | Jul 25, 2023 |
| Priority date | — |
| Expiry date | Jul 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/173
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments may relate to a method of forming a microelectronic package with an integrated heat spreader (IHS). The method may include placing a solder thermal interface material (STIM) layer on a face of a die that is coupled with a package substrate; coupling the IHS with the STIM layer and the package substrate such that the STIM is between the IHS and the die; performing formic acid fluxing of the IHS, STIM layer, and die; and dispensing, subsequent to the formic acid fluxing, sealant on the package substrate around a periphery of the IHS.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.