Ken Hackenberg
10Patents
1h-index
29Co-inventors
43Inventor score
Filing activity: Dec 7, 2016 → Dec 20, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10224299B2 | Sintered solder for fine pitch first-level interconnect (FLI) applications | Electricity | 1 | Active |
| US10515914B2 | Sintered solder for fine pitch first-level interconnect (FLI) applications | Electricity | 0 | Active |
| US11710672B2 | Microelectronic package with underfilled sealant | Electricity | 0 | Active |
| US11798861B2 | Integrated heat spreader (IHS) with heating element | Electricity | 0 | Active |
| US11791237B2 | Microelectronic assemblies including a thermal interface material | Electricity | 0 | Active |
| US11404349B2 | Multi-chip packages and sinterable paste for use with thermal interface materials | Electricity | 0 | Active |
| US12272614B2 | Integrated circuit packages with solder thermal interface materials with embedded particles | Electricity | 0 | Active |
| US12062592B2 | Integrated circuit packages with thermal interface materials with different material compositions | Electricity | 0 | Active |
| US11710677B2 | Ultraviolet (UV)-curable sealant in a microelectronic package | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US11832419B2 | Full package vapor chamber with IHS | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.