Patent · US Active

Embedded component and methods of making the same

US11710674B2 · kind B2 · utility

0Cited by

8References

12Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Yi Xu · Folsom, US
Bilal Khalaf · Folsom, US
Dennis Sean Carr · Folsom, US

Key dates

Filing date	Mar 29, 2022
Grant date	Jul 25, 2023
Priority date	—
Expiry date	Mar 29, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Various embodiments disclosed relate to a substrate for a semiconductor device. The substrate includes a first major surface and a second major surface opposite the first major surface. The substrate further includes a cavity defined by a portion of the first major surface. The cavity includes a bottom dielectric surface and a plurality of sidewalls extending from the bottom surface to the first major surface. A first portion of a first sidewall includes a conductive material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.