Ultraviolet (UV)-curable sealant in a microelectronic package
US11710677B2 · kind B2 · utility
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1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2019 |
| Grant date | Jul 25, 2023 |
| Priority date | — |
| Expiry date | Sep 22, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2230/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments may relate to a microelectronic package that includes an integrated heat spreader (IHS) coupled with a package substrate. The microelectronic package may further include a sealant material between the package substrate and the IHS. The sealant material may be formed of a material that cures when exposed to ultraviolet (UV) wavelengths. Other embodiments may be described or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.