Metal bump structure and manufacturing method thereof and driving substrate
US11715715B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2021 |
| Grant date | Aug 1, 2023 |
| Priority date | — |
| Expiry date | Mar 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a metal bump structure is provided. A driving base is provided. At least one pad and an insulating layer are formed on the driving base. The pad is formed on an arrangement surface of the driving base and has an upper surface. The insulating layer covers the arrangement surface of the driving base and the pad, and exposes a part of the upper surface of the pad. A patterned metal layer is formed on the upper surface of the pad exposed by the insulating layer, and extends to cover a part of the insulating layer. An electro-less plating process is performed to form at least one metal bump on the patterned metal layer. A first extension direction of the metal bump is perpendicular to a second extension direction of the driving base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.