Integrated circuit device and method of manufacturing the same
US11715786B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2021 |
| Grant date | Aug 1, 2023 |
| Priority date | — |
| Expiry date | Jul 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/85
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An integrated circuit device includes: a fin-type active area including a fin top surface on a top portion and an anti-punch-through recess having a lowermost level lower than a level of the fin top surface; a nanosheet stack facing the fin top surface, the nanosheet stack including a plurality of nanosheets having vertical distances different from each other from the fin top surface; a gate structure surrounding each of the plurality of nanosheets; a source/drain region having a side wall facing at least one of the plurality of nanosheets; and an anti-punch-through semiconductor layer including a first portion filling the anti-punch-through recess, and a second portion being in contact with a side wall of a first nanosheet most adjacent to the fin-type active area among the plurality of nanosheets, the anti-punch-through semiconductor layer including a material different from a material of the source/drain region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.