Method for simultaneously cutting a plurality of disks from a workpiece
US11717930B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2021 |
| Grant date | Aug 8, 2023 |
| Priority date | — |
| Expiry date | Feb 18, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/0076
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method cuts semiconductor wafers. The method includes: cutting a semiconductor ingot into a workpiece; and sawing the workpiece into slices using a wire grid having a fixed abrasive grain wire, while moving workpiece towards the wire grid. At a first contact of the workpiece with the wire grid, an initial cutting speed is less than 2 mm/min, coolant flow is less than 0.1 l/h and a wire speed is greater than 20 m/s. The workpiece is then guided through the wire grid until a first cutting depth is reached, and then the coolant flow is increased to at least 2000 l/h. The cutting speed is reduced to less than 70% of the initial cutting speed between the first contact of the workpiece with the wire grid up to a cutting depth of half a diameter of the cylinder, and is then increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.