Integrated sensor for multi-dimensional signal analysis

US11719639B2 · kind B2 · utility

Assignee

• Quantum-Si Incorporated · US

Inventors

• Gerard Schmid · Guilford, US
• Dajiang Yang · San Jose, US
• Eric A. G. Webster · Mountain View, US
• Xin Wang · San Jose, US
• Todd Rearick · Cheshire, US
• Changhoon Choi · Palo Alto, US
• Ali Kabiri · Guilford, US
• Kyle Preston · Guilford, US
• Brian Reed · Berkley, US

Key dates

• Filing date: Mar 2, 2021
• Grant date: Aug 8, 2023
• Expiry date: Mar 17, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N2021/6471
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Some aspects relate to an integrated circuit, comprising at least one photodetection region configured to generate charge carriers responsive to incident photons emitted from a sample, at least one charge storage region configured to receive the charge carriers from the photodetection region, and at least one controller configured to obtain information about the incident photons, the information comprising at least one member selected from the group comprising pulse duration and interpulse duration and at least one member selected from the group comprising wavelength information, luminescence lifetime information, and intensity information. In some embodiments, the information comprises at least three, four, and/or five members selected from the group comprising wavelength information, luminescence lifetime information, intensity information, pulse duration information, and interpulse duration information. In some embodiments, the information obtained may be used to identify the sample.