Method and apparatus for conducting burn-in testing of semiconductor devices
US11719743B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2021 |
| Grant date | Aug 8, 2023 |
| Priority date | — |
| Expiry date | Jun 8, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2877
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for conducting burn-in testing of semiconductors is provided. A semiconductor device under test (DUT) with a plurality of contact pads is placed into a seal carrier. The seal carrier is then placed within a plurality of first inner walls of an outer housing of a burn-in testing apparatus that is fastened to a cold plate through a printed circuit board (PCB). The seal carrier has a plurality of second inner walls that define a recessed cavity. A lid is placed over the seal carrier and fastened to the outer housing to seal the recessed cavity. The recessed cavity is pneumatically pressurized to force the contact pads of the semiconductor DUT into electrical contact with a plurality of resiliently compressible pins of a socket of the PCB. The socket is then energized to conduct a burn-in test of the semiconductor DUT.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.