Cost-effective lead-free solder alloy for electronic applications
US11724342B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2021 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Aug 31, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/025
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.