Porous polyurethane polishing pad and preparation method thereof
US11724356B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Aug 22, 2018 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Jun 16, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2375/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for producing the same. In the porous polyurethane polishing pad, it is possible to control the size and distribution of pores, whereby the polishing performance (i.e., polishing rate) of the polishing pad can be adjusted, by way of employing thermally expanded microcapsules as a solid phase foaming agent and an inert gas as a gas phase foaming agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.