Method of coating a photoresist and apparatus for performing the same
US11726406B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 12, 2022 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Apr 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In a method of coating a photoresist, the photoresist may be provided to an upper surface of a rotating wafer. A hovering solution may be injected to an edge portion of the photoresist under a condition that the hovering solution may be hovered with respect to the edge portion of the photoresist with an air layer being interposed between the hovering solution and the edge portion of the photoresist to limit and/or prevent a bead of the photoresist from being formed on an edge portion of the upper surface of the wafer. Thus, the photoresist having a uniform thickness may be coated on the upper surface of the wafer to improve a yield of a semiconductor device by increasing an effective area of the edge portion of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.