Wafer bonding apparatuses
US11728200B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2019 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Jan 7, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L24/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer bonding apparatus is provided includes a lower support plate configured to structurally support a first wafer on an upper surface of the lower support plate; a lower structure adjacent to the lower support plate and movable in a vertical direction that is perpendicular to the upper surface of the lower support plate, an upper support plate configured to structurally support a second wafer on a lower surface of the lower support plate, and an upper structure adjacent to the upper support plate and movable in the vertical direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.