Patent · US Active

Semiconductor package with connection lug

US11728250B2 · kind B2 · utility

1Cited by

1References

20Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Edward Fuergut · Nuremberg, DE
Martin Gruber · Schwandorf, DE
Herbert Hopfgartner · Seeboden, AT
Bernd Schmoelzer · Radenthein, AT

Key dates

Filing date	May 20, 2021
Grant date	Aug 15, 2023
Priority date	—
Expiry date	Feb 3, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a first die pad, a first semiconductor die mounted on the first die pad, an encapsulant body of electrically insulating material that encapsulates first die pad and the first semiconductor die, a plurality of package leads that each protrude out of a first outer face of the encapsulant body, a connection lug that protrudes out of a second outer face of the encapsulant body, the second outer face being opposite from the first outer face. The first semiconductor die includes first and second voltage blocking terminals. The connection lug is electrically connected to one of the first and second voltage blocking terminals of the first semiconductor die. A first one of the package leads is electrically connected to an opposite one of the first and second voltage blocking terminals of the first semiconductor die that the first connection lug is electrically connected to.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.