Bernd Schmoelzer
12Patents
1h-index
24Co-inventors
46Inventor score
Filing activity: Nov 24, 2016 → Oct 16, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10373897B2 | Semiconductor devices with improved thermal and electrical performance | Electricity | 3 | Active |
| US11728250B2 | Semiconductor package with connection lug | Electricity | 1 | Active |
| US10755999B2 | Multi-package top-side-cooling | Electricity | 1 | Active |
| US11876028B2 | Package with electrically insulated carrier and at least one step on encapsulant | Electricity | 1 | Active |
| US11211304B2 | Assembly and method for mounting an electronic component to a substrate | Electricity | 0 | Active |
| US12002739B2 | Semiconductor device including an embedded semiconductor die | Electricity | 0 | Active |
| US10699978B2 | SMD package with top side cooling | Electricity | 0 | Active |
| US12080669B2 | Semiconductor device module having vertical metallic contacts and a method for fabricating the same | Electricity | 0 | Active |
| US9972576B2 | Semiconductor chip package comprising side wall marking | Electricity | 0 | Active |
| US12094793B2 | Package with electrically insulated carrier and at least one step on encapsulant | Electricity | 0 | Active |
| US11942383B2 | Linear spacer for spacing a carrier of a package | Electricity | 0 | Active |
| US12125772B2 | Method of forming a semiconductor package with connection lug | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.