Optically-enhanced multichip packaging
US11728894B2 · kind B2 · utility
1Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2021 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Apr 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B10/502
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Optical chip-to-chip interconnects may use microLEDs as light sources. The interconnected chips may be on a same substrate. A pair of endpoint chips may each have associated optical transceiver subsystems, with transceiver circuitry in transceiver chips. Optical communications may be provided between the optical transceiver subsystems, with the optical transceiver subsystems in communication with their associated endpoint chips by way of metal layers in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.