Near-hermetic package with flexible signal input and output
US11729933B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2022 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Feb 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure provides a low-cost near-hermetic package, which may a substrate configured to support one or more internal components. The package may also include an enclosure comprising a cavity surrounding the one or more internal components and a first sidewall extending upward from the substrate. The first sidewall may be coupled to the substrate. The package may further include a first flexible circuit comprising conductive traces configured to connect to the one or more internal components. The first flexible circuit may include a first section outside the first sidewall of the enclosure, a second section inside the enclosure, and a third section between the first section and the second section joining to the enclosure and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.