Integrated ultrasonic transducers
US11730451B2 · kind B2 · utility
0Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2021 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Aug 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.