Heat dissipation device
US11732981B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2022 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Jul 9, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.