Semiconductor fabricating apparatus including a probe station
US11733269B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 14, 2021 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Aug 19, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2887
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor fabricating apparatus may include a probe card, a test head, a support and a chamber wall. The probe card may include a plurality of probing needles. The probe card may be installed at the test head. The support may be configured to receive a wafer including a plurality of test pads making contact with the probing needles. The chamber wall may be configured to receive the support. The chamber wall may define a chamber in which a probe test may be performed. At least one of the probe card and the support, the probe card and the test head, and the test head and the chamber wall may be combined with each other by a magnetic module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.