Polishing apparatus including polishing pad conditioner, non-contact displacement sensor, and data processor
US11735427B2 · kind B2 · utility
0Cited by
13References
15Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 8, 2021 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Dec 8, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.