Wireless device with waveguiding structures between radiating structures and waveguide feeds
US11735806B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2018 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Oct 13, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15321
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A high frequency wireless device includes a three-dimensional (3D) antenna structure mounted on a PCB including a first antenna connected to a first waveguide feed and second antenna connected to a second waveguide feed. A packaged device on the PCB has a top metal surface including a transmit (Tx) radiating structure under the second waveguide feed and a receive (Rx) radiating structure under the first waveguide feed, and an RF connection from the top metal surface to its bottom surface. An IC die is flipchip attached to the bottom surface including at least one Rx channel and at least one Tx channel connected by the RF connection to the Rx and Tx radiating structures. Protruding metal features are on the dielectric layer under the first and second waveguide feeds on ≥2 sides of the Tx and the Rx radiating structure to create a waveguiding wall structure for directing signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.