Apparatuses and methods for monitoring health of probing u-bump cluster using current divider
US11740282B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2022 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Mar 31, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01033
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus includes an input probe configured to be placed on a first cluster of u-bumps disposed on a semiconductor die, output probes configured to be respectively placed on multiple clusters of u-bumps disposed on the semiconductor die, the multiple clusters being separately connected to the first cluster. The apparatus further includes a space transformer and printed circuit board (PCB) portion including a current source configured to supply a current to the input probe placed on the first cluster, resistors having a same resistance and being connected to ground, and tester channels at which voltages are respectively measured, the tester channels being respectively connected to ends of the output probes respectively placed on the multiple clusters and being respectively connected to the resistors. The apparatus further includes a processor configured to determine whether the input probe is properly aligned with the first cluster, based on the measured voltages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.