Power semiconductor device including press-fit connection terminal
US11742251B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2020 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Apr 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power semiconductor device includes: a power semiconductor element; a control circuit that controls the power semiconductor element; a control substrate having the control circuit mounted thereon; a lid arranged to overlap with at least a portion of the control substrate in a first direction; and at least one external connection terminal having a first portion connected with the control substrate, a second portion to be connected with an external apparatus, and a third portion located between the first portion and the second portion and fixed to the lid, the first portion being constituted as a press-fit portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.