Minoru Egusa
7Patents
1h-index
12Co-inventors
40Inventor score
Filing activity: Feb 13, 2014 → Aug 14, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9640453B2 | Power semiconductor device | Electricity | 3 | Active |
| US9979105B2 | Power semiconductor device | Electricity | 1 | Active |
| US11631653B2 | Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication method | Electricity | 0 | Active |
| US10388581B2 | Semiconductor device having press-fit terminals disposed in recesses in a case frame | Electricity | 0 | Active |
| US11569197B2 | Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication method | General | 0 | Revoked |
| US9887142B2 | Power semiconductor device | Electricity | 0 | Active |
| US11742251B2 | Power semiconductor device including press-fit connection terminal | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.