Package structure applied to power converter
US11742268B2 · kind B2 · utility
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3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2021 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Oct 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1425
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure applied to power converters can include: a first die having a first power transistor and a first control and drive circuit; a second die having a second power transistor; a connection device configured to couple the first and second power transistors in series between a high-level pin and a low-level pin of a lead frame of the package structure; and where a common node of the first and second power transistors can be coupled to an output pin of the lead frame through a metal connection structure with a low interconnection resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.