Electronic package and manufacturing method thereof
US11742296B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Dec 28, 2020 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Jan 20, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/182
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.