Bulk acoustic resonator with heat dissipation structure and fabrication process
US11742824B2 · kind B2 · utility
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Key dates
| Filing date | Aug 12, 2020 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Aug 12, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D30/70
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A bulk acoustic resonator having a heat dissipation structure, and a fabrication process are provided according to the present application. The bulk acoustic resonator includes a substrate, a metal heat dissipation layer formed on the base substrate and provided with an insulating layer on the surface thereof, and a resonance functional layer formed on the insulating layer, where the metal heat dissipation layer and the insulating layer together define a cavity on the substrate, a side wall of the cavity is formed by the insulating layer, and a bottom electrode layer in the resonance function layer covers the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.