Linping LI
11Patents
0h-index
2Co-inventors
27Inventor score
Filing activity: Jun 28, 2020 → Dec 19, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11552028B2 | Chip packaging method and chip packaging structure | Electricity | 0 | Active |
| US12113503B2 | Manufacturing process for bulk acoustic resonator, and bulk acoustic resonator | Electricity | 0 | Active |
| US11695386B2 | Solidly mounted resonator having electromagnetic shielding structure, and manufacturing process | Electricity | 0 | Active |
| US11770920B2 | EMI shielding material, EMI shielding process, and communication module product | Electricity | 0 | Active |
| US11973484B2 | Acoustic resonator with reinforcing structure and manufacturing method therefor | Electricity | 0 | Active |
| US11881839B2 | Acoustic resonator assembly and filter | Electricity | 0 | Active |
| US12166469B2 | Cavity structure of bulk acoustic resonator, and manufacturing process | Electricity | 0 | Active |
| US11742824B2 | Bulk acoustic resonator with heat dissipation structure and fabrication process | Emerging Cross-Sectional Technologies | 0 | Active |
| US11901872B2 | Thin film bulk acoustic resonator and manufacturing process therefor | Electricity | 0 | Active |
| US11177141B2 | Method for packaging a chip | Electricity | 0 | Active |
| US10985120B1 | Chip packaging method and chip packaging structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.