Duct arrangement for cooling server DIMM or other heat-generating components
US11744037B1 · kind B1 · utility
0Cited by
10References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2021 |
| Grant date | Aug 29, 2023 |
| Priority date | — |
| Expiry date | Jun 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An airflow duct can be arranged at least in part in a zone alongside an electronics board mounted to a motherboard. The airflow duct can include an inlet end arranged to receive airflow into the airflow duct. A closed end wall can be arranged opposite the inlet end. A set of walls may extend from the inlet end to the closed end wall and include a top wall, a bottom wall, a first lateral side wall, and a second lateral side wall. Orifices can be included in the set of walls and can be arranged to direct airflow from within the airflow duct toward heat-producing components borne by the electronics board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.