Single step electrolytic method of filling through holes in printed circuit boards and other substrates
US11746433B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2019 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Nov 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one or more through-holes and/or one or more micro-vias in the electronic substrate; and (3) electroplating copper in the at one or more through-holes and/or one or more micro-vias by contacting the electronic substrate with an acid copper electroplating solution. The acid copper plating solution comprises a source of copper ions; sulfuric acid; a source of chloride ions; a brightener; a wetter; and a leveler. The acid copper electroplating solution plates the one or more through-holes and/or the one or more micro-vias until metallization is complete.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.