Thermal structures adapted to electronic device heights in integrated circuit (IC) packages
US11749579B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2021 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Jun 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC package includes a heat-generating device and an electrical device on a surface of a substrate, a mold compound disposed on the electrical device, and a thermal structure disposed on the heat-generating device, without the mold compound, to improve heat dissipation. In an example, the thermal structure includes a thermal interface material (TIM) layer and a heat sink. In the example, the TIM layer extends from the heat-generating device to a height equal to or less than the mold compound and the heat sink includes a planar exterior surface above the heat-generating device and the electrical device. In an example, a first heat sink portion of the heat sink on the heat-generating device may be a different thickness than a second heat sink portion of the heat sink on the electrical device. The thermal structure reduces a thermal resistance between the heat-generating device and the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.