Bohan Yan
3Patents
1h-index
5Co-inventors
30Inventor score
Filing activity: Jun 25, 2018 → Mar 1, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10679919B2 | High thermal release interposer | Electricity | 1 | Active |
| US11437335B2 | Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods | Electricity | 0 | Active |
| US11749579B2 | Thermal structures adapted to electronic device heights in integrated circuit (IC) packages | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.