Semiconductor device and corresponding method
US11749588B2 · kind B2 · utility
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14Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 14, 2020 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Aug 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises at least one semiconductor die electrically coupled to a set of electrically conductive leads, and package molding material molded over the at least one semiconductor die and the electrically conductive leads. At least a portion of the electrically conductive leads is exposed at a rear surface of the package molding material to provide electrically conductive pads. The electrically conductive pads comprise enlarged end portions extending at least partially over the package molding material and configured for coupling to a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.