Hybrid under-bump metallization component
US11749605B2 · kind B2 · utility
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4References
13Claims
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Key dates
| Filing date | Dec 9, 2020 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Aug 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/608
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Devices and methods that can facilitate hybrid under-bump metallization components are provided. According to an embodiment, a device can comprise an under-bump metallization component that can comprise a superconducting interconnect component and a solder wetting component. The device can further comprise a solder bump that can be coupled to the superconducting interconnect component and the solder wetting component. In some embodiments, the superconducting interconnect component can comprise a hermetically sealed superconducting interconnect component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.