Semiconductor device including vertical wire bonds

US11749647B2 · kind B2 · utility

Assignee

• Western Digital Technologies, Inc. · US

Inventors

• Xiaofeng Di · Shanghai, CN
• Junrong Yan · Shanghai, CN
• CheeKeong Chin · Shanghai, CN
• Weili Wang · Buffalo Grove, US
• Xin Lu · Tokyo, JP
• Qi Deng · Beijing, CN
• Chaur Yang Ng · Merang, MY
• Cong Zhang · Shandong, CN
• Chenlin Yang · Shanghai, CN
• Chin-Tien Chiu · Taichung, TW

Key dates

• Filing date: Dec 30, 2020
• Grant date: Sep 5, 2023
• Expiry date: Dec 30, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19105
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.