Patent · US Active

Optoelectronic semiconductor component

US11749776B2 · kind B2 · utility

0Cited by

4References

17Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Karl Weidner · Birkenfeld, DE
Ralph Wirth · Lappersdorf, DE
Axel Kaltenbacher · Ingolstadt, DE
Walter Wegleiter · Nittendorf, DE
Bernd Barchmann · Regensburg, DE
Oliver Wutz · Regensburg, DE
Jan Marfeld · Regensburg, DE

Key dates

Filing date	Dec 16, 2021
Grant date	Sep 5, 2023
Priority date	—
Expiry date	Dec 16, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/853
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.