Base material for printed circuit board and printed circuit board
US11752734B2 · kind B2 · utility
0Cited by
2References
7Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 24, 2018 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Sep 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0338
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A base material for a printed circuit board includes: an insulating base film; and a sintered body layer of metal particles layered on one side surface of the base film; wherein an arithmetic mean roughness (Sa) of a surface of the sintered body layer that is opposite to the base film is greater than or equal to 0.005 μm and less than or equal to 0.10 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.