Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agent
US11753499B2 · kind B2 · utility
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6References
15Claims
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Key dates
| Filing date | Jan 26, 2018 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Aug 24, 2039 |
Classification
- Technology area (CPC —)General
Abstract
An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.