Oligomer, composition, packaging structure, and method of disassembling packaging structure
US11753502B2 · kind B2 · utility
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2References
5Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 18, 2022 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Jan 18, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2115/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of wherein X is —O—, and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.