Chi-Fu Tseng
6Patents
1h-index
12Co-inventors
44Inventor score
Filing activity: Dec 1, 2009 → Jun 2, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8182892B2 | Substrate structures applied in flexible electrical devices and fabrication method thereof | Emerging Cross-Sectional Technologies | 4 | Active |
| US9209403B2 | Method for fabricating flexible electrical devices | Emerging Cross-Sectional Technologies | 1 | Active |
| US11823895B2 | Methods and devices for graphene formation on flexible substrates by plasma-enhanced chemical vapor deposition | Electricity | 0 | Active |
| US8859715B2 | Polyimide polymer solution, polyimide polymer, transparent film, displaying device and solar cell | Emerging Cross-Sectional Technologies | 0 | Active |
| US11753502B2 | Oligomer, composition, packaging structure, and method of disassembling packaging structure | Chemistry; Metallurgy | 0 | Active |
| US11845883B2 | Double-sided optically clear adhesive and multilayer structure including the same | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.