Slotted vias for circuit boards
US11758644B2 · kind B2 · utility
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20Claims
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Assignee
Inventors
Key dates
| Filing date | May 13, 2021 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Dec 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09645
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board may include a traditional via electrically coupled to a first layer of the circuit board and coupled to a second layer of the circuit board and a slotted via formed within the circuit board proximate to the traditional via, the slotted via comprising an opening through a first surface and a second surface of the circuit board and a layer of conductive material formed on interior walls of the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.