Lingyu Kong
8Patents
1h-index
15Co-inventors
40Inventor score
Filing activity: Feb 24, 2017 → Jun 15, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11177159B2 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Electricity | 2 | Active |
| US12207391B2 | Hatching ground under a pad in a printed circuit board | Electricity | 0 | Active |
| US11758644B2 | Slotted vias for circuit boards | Electricity | 0 | Active |
| US11791202B2 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Electricity | 0 | Active |
| US12040274B2 | Microelectronic devices including differently sized conductive contact structures, and related memory devices, electronic systems, and methods | Electricity | 0 | Active |
| US12376303B2 | Electronic devices including a source seal, and related methods and electronic systems | Electricity | 0 | Active |
| US10134599B2 | Self-anchored catalyst metal-assisted chemical etching | Electricity | 0 | Active |
| US12408263B2 | Differential pair inner-side impedance compensation | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.