Electromagnetic wave shielding film
US11758705B2 · kind B2 · utility
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3Claims
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Key dates
| Filing date | Feb 25, 2021 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Feb 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0715
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is an electromagnetic wave shielding film capable of easily exhibiting excellent conductivity between a ground member and a shielding layer when the ground member is disposed on the electromagnetic wave shielding film. In the electromagnetic wave shielding film 1, the conductive adhesive layer 11, the shielding layer 12, and the insulating layer 13 are laminated in this order, and a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layer 11 in accordance with ISO14577-1 to Martens hardness of the insulating layer 13 in accordance with ISO14577-1 is 0.3 or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.