Polishing pad, preparation method thereof and method for preparing semiconductor device using same
US11759909B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jun 16, 2021 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | May 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.