Resin composition and article made therefrom
US11760876B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2021 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | May 25, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2479/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.